1. 86899 Landsberg Si-Mat Silicon Materials

86899 Landsberg Si-Mat Silicon Materials

2. Mitcham Mirko Hess Consultants

Mitcham Mirko Hess Consultants

3. 01109 Dresden Fraunhofer IPMS

01109 Dresden Fraunhofer IPMS

4. Low Pressure CVD (LPCVD)
(Semiconductor Assembly Process/Separation)

In this application for the production of films with low thickness of silicon, nitrides, but also of polysilicon and tungsten, the plant evacuated reaction (correspondingly low pressure CVD, LPCVD). Among ...