1. 74855 Hassmersheim CPL Connector Productions GmbH

74855 Hassmersheim CPL Connector Productions GmbH  ...

2. 79111 Freiburg etp – electronics trading & production e.K.

79111 Freiburg etp – electronics trading & production e.K.  ...

3. 25479 Ellerau Partner Productions import&Export Ltd

25479 Ellerau Partner Productions import&Export Ltd  ...

4. 85521 Ottobrunn bei München Deim Electronic Production

85521 Ottobrunn bei München Deim Electronic Production  ...

5. The Basics of Semiconductor Technology
(Semiconductor Technology Basics/Applications of Semiconductors)

... which virtually no current flow is possible.   With the option, in the production of such material, the electrical conductivity targeted to change, are very wide scope of applications.   To those ...

6. Introduction
(Semiconductor Technology Basics/Applications of Semiconductors)

... no longer be ignored.   At this point, should begin fundamentally the electrical properties of a semiconductor explained. Then follows a summary of the different production techniques in the semiconductor ...

7. Plasma Etching
(Semiconductor Assembly Process/Etching Technology)

... link The plasma state; production and maintenance) may be a large number of electrons separated from their atoms move, which therefore remain in the ionized state. In this highly energy-rich plasma state ...

8. Dry Etching Process
(Semiconductor Assembly Process/Etching Technology)

... that the material is not under the mask worn edges. This condition is essential for the production of highly miniaturized structures, so that the use of this technology, despite the increased expense is ...

9. Cleaning Techniques
(Semiconductor Assembly Process/Etching Technology)

... of foreign substances was extremely reduced. From this so-called pure water in the semiconductor production consumes a substantial amount. By cleaning in an ultrasonic bath can also be highly adherent ...

10. Other Impurities
(Semiconductor Assembly Process/Etching Technology)

In the production process can still be many other influences disrupt the chip processing. These include the abrasion of moving production, not removed material from previous process steps (eg photo-coat) ...

11. Application for Wafer Cleaning
(Semiconductor Assembly Process/Etching Technology)

Avoid contamination, cleanroom technology To avoid contamination during the production process, the subsequent suitability of the chips can disturb, many efforts must be undertaken. A major emphasis is ...

12. The Chemical Components
(Semiconductor Assembly Process/Lithography)

... light. In the production will be in areas of lithography steps with yellow light worked. Binders As a binder novolac often used. This is a phenolic resin (synthetic resin) is a strong influence on the ...

13. Other Techniques for Imaging
(Semiconductor Assembly Process/Lithography)

Also by the effect of ion beam exposure can take place. This method, however, has not yet entered the industrial production is found, because they are not yet sufficient speed with reasonable effort is ...

14. Optical Imaging
(Semiconductor Assembly Process/Lithography)

... used triggers the dissolution of the procedure to their limits. We therefore used short ultraviolet light. High-resolution systems to achieve mass production while extending 100 nm structures. It uses ...

15. Exposure
(Semiconductor Assembly Process/Lithography)

... this technique is not yet developed for use in the production mature. The procedures differ in their resolution. For optical imaging techniques, the resolution because of diffraction effects limits. ...

16. Chemical Mechanical Polishing (CMP Process)
(Semiconductor Assembly Process/Metallization)

... and so the excavated material. With this technique can be very precise wafer surface leveling. But she does not often used, because the production process significantly complicated. [backbutton]  ...

17. Multilayer Wiring
(Semiconductor Assembly Process/Metallization)

For the production and cross superimposed by the Traces technique of multi-layer wiring needed. Because the traces are often a dominating share of the area on the chip are taking place can be greatly reduced ...

18. The Use of Copper
(Semiconductor Assembly Process/Metallization)

...  As well as aluminum and copper has a high susceptibility to corrosion. A major problem in the use of copper is that the semiconductor material quickly and these contaminated materials in the production ...

19. Evaporation
(Semiconductor Assembly Process/Separation)

In this process, the metal deposits for the production of contacts realized often the case in which aluminum is used. The material on the wafer to be separated, will completely or by an electron beam only ...

20. The Plasma State; Production and Maintenance
(Semiconductor Assembly Process/Separation)

... should be encouraged, where it is not by itself would expire. This can then be applied already fragile structures will be spared. Figure 36: plasma production by ionization of a gas in an electrical ...

21. Plasma Enhanced CVD (PECVD
(Semiconductor Assembly Process/Separation)

... in this alone will not onset of decomposition reactions of the process gases will be through encouragement of a plasma (see link: The plasma state; production and maintenance) with high frequency electric ...

22. Low Pressure CVD (LPCVD)
(Semiconductor Assembly Process/Separation)

In this application for the production of films with low thickness of silicon, nitrides, but also of polysilicon and tungsten, the plant evacuated reaction (correspondingly low pressure CVD, LPCVD). Among ...

23. Wet Oxidation
(Semiconductor Assembly Process/Oxidation)

... a fast, with inferior quality compared to dry oxidation, so this technique, for example, used to mask production. [backbutton]  ...

24. Doping with Nuclear Reaction
(Semiconductor Assembly Process/Doping)

Another possibility for endowing the entire wafer, but not (yet) is applied to production, there is the use of nuclear reactions in the semiconductor material. It irradiates the substrate, for example, ...

25. Doping
(Semiconductor Assembly Process/Doping)

... doping by diffusion and ion implantation are now mainly used in production methods. The alloy has with doping in silicon technology no longer high priority. We want to be deepened with the former two procedures. ...