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Semiconductor Technology
Introduction
Semiconductor Technology Basics
Structure of the Subject
The Atom
Classification / Periodic Table
Elements
Covalent Bond
Solid Composite
Ionic Bond
Metal Binding
Electrical Conductivity of Solid
Conductor
Semiconductor
Nonconductor
Energy Bands Theory
Tapes Theory
Influencing of the Direction Property
Application of Semiconductors
p-n Transition
Bipolar Transistor
Process Steps Semiconductor Production
Production Process
The Basic Substrate - The Wafer
Production of high purity Silicon
Dry Cleaning
Cleaning Zone
Production of Silicon single Crystals
Crystal Pull Proceed
Crucible free float Zone
Manufacture of Wafers
Saw
Lapping
Round the Edge of the Disc
Etching
Buffing
Wafer Diameter
Doping
Doping by Diffusion
Gas Phase Diffusion
Diffusion from liquid Source
Solid Diffusion
Properties of Diffusion Technology
Ion Implantation
Penetration of the Ions into the Substrate
Channeling
Building of a Plant for Ion Implantation
Properties of Ion Implantation
Doping with Alloy
Doping with Nuclear Reaction
Oxidation
Thermal Oxidation
Dry Oxidation
Wet Oxidation
H2O2 Combustion
Peculiarities of the Thermal Oxidation Process
Segregation
Oxidation in the Separation Procedure
Silane Pyrolysis
TEOS Capture
The LOCOS Technology
Measurement of Oxide Thickness
Interferometry
Spectroscopy
Ellipsometry
Deposition
Dry Deposition Procedure
Vapor Phase
Chemical Vapor Deposition (CVD)
Atmospheric Pressure CVD (APCVD)
Low Pressure CVD (LPCVD)
Plasma Enhanced CVD (PECVD)
The Plasma State
Physical Vapor Deposition
Molecular Beam Epitaxy (MBE)
Evaporation
Cathode Atomisation, Sputtering
Metallization
The Metal-Semiconductor Transition
Peculiarities of the Silicon-Aluminum Contact
Effect of Aluminum as Dopant
Metal Spikes in Silicon
Wear Contacts by Electrical Migration
The Use of Copper
Consideration in the Design of the Metallization Plane
Protection of the Chip Surface by Coating and Passivation
Multilayer Wiring
Techniques for Leveling
BPSG-Reflow
Reflow Etch Back
Chemical-Mechanical Polishing
Contacts between Metallization Plane
Structuring
Lithography
Application of the Coating
Exposure
Optical Imaging
Technical Realization
Sources of Error in the Optical Imaging Technology
X-Ray Lithography
Electron Beam Lithography
Other Techniques
The Photoresist
The Chemical Components
Development
Lacquer Control
Lacquer Displacement
Mask Technology
Etching
Wet Chemical Etching
Election of Etchants
Technical Implementation of the Wet Chemical Etching
Use for Wafer Cleaning
Consequences of Pollution by Particles
Other Impurities
Cleaning Techniques
Dry Etching Procedure
Ion Beam Etching
Plasma Etching
Reactive Ion Etching (RIE)
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